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Microelectronics Packaging Materials Database
Microelectronics Packaging Materials Database (MPMD)
| General information |
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| Name: | Microelectronics Packaging Materials Database |
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| Abbreviation: | MPMD |
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| Website: | https://cindasdata.com/products/mpmd |
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| e-Mail: | sales@csa.com |
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| Comments: | Physical and physical-chemical properties of materials for microelectronics. |
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| Status: | active |
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| Keywords |
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| ceramics, chemical, creep, Curie point, density, dielectric constant, dielectric losses, fatigue, hardness, heat capacity, mechanical, metal, modulus Young, physical, piezoelectric, refractive index, Seebeck coefficient, semiconducting, strength, thermal conductivity, thermal expansion |
| Developers |
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| Country | Name | Address |
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| USA | Center for Information and Numerical Data Analysis and Synthesis of Purdue University (CINDAS) | West Lafayette, Indiana 47906 USA |
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| Literature References |
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| № | Authors | Name | Source | Year | Volume | Number | Pages |
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| 1 | Ho C. Y.,
Li H.H. | Numerical databases on materials property data at CINDAS/Purdue University
 | J.Chem.Inf. and Comput.Sci. | 1993 | 33 | 1 | 36-45 |
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+7 (499) 135-25-91