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Microelectronics Packaging Materials Database


Microelectronics Packaging Materials Database (MPMD)

General information
Name:Microelectronics Packaging Materials Database
Abbreviation:MPMD
Website:https://cindasdata.com/
Phone:
Fax:
e-Mail:sales@csa.com
Comments:Physical and physical-chemical properties of materials for microelectronics.

Keywords
ceramics, chemical, creep, Curie point, density, dielectric constant, dielectric losses, fatigue, hardness, heat capacity, mechanical, metal, modulus Young, physical, piezoelectric, refractive index, Seebeck coefficient, semiconducting, strength, thermal conductivity, thermal expansion

Developers
CountryNameAddress
USACenter for Information and Numerical Data Analysis and Synthesis of Purdue University (CINDAS)West Lafayette, Indiana 47906 USA

Literature References
AuthorsNameSourceYearVolumeNumberPages
1Ho C. Y.,
Li H. H.
Numerical databases on materials property data at CINDAS/Purdue University
View PDF
J.Chem.Inf. and Comput.Sci.199333136-45


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