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Ishida K., Kainuma R., Koyama T., Liu X. J., Ode M., Ohnuma I., Onodera H., Suzuki T., Wang C.P.
Thermodynamic database on microsolders and copper-based alloy systems
// J.Electron. Mater.. 2003. Volume: 32. Number: . Pages: 1265-1272.

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